| December 13, 2005 |
SANMINA-SCI LICENSES BURIED CAPACITANCE® TECHNOLOGY TO TAIWAN UNION TECHNOLOGY CORPORATION
SAN JOSE, Calif. – December 13, 2005 — Sanmina-SCI Corporation (Nasdaq NM: SANM), a leading global electronics manufacturing services (EMS) company, today announced that it has entered into a licensing agreement with Taiwan Union Technology Corporation (TUC; TAIEX: 6274), a leading manufacturer of copper clad laminates, to manufacture laminates for use in multilayer printed circuit boards (PCBs) using Sanmina-SCI’s patented Buried Capacitance® technology.
TUC joins an established network of laminators and PCB manufacturers who use Buried Capacitance technology to produce products for a wide array of customers within the computer, networking and telecommunications industries. According to the licensing agreement, TUC will implement the technology at its manufacturing facility in Taiwan.
“We welcome Taiwan Union Technology Corporation to the family of licensed Buried Capacitance manufacturers,” said Greg Schroeder, Senior Manager, Licensing and Intellectual Property Group for Sanmina-SCI’s PCB Division. “TUC is joining a select group of top-tier laminators who recognize the value of this technology in meeting the needs of their customers.”
“Having the Buried Capacitance license enables us to strengthen partnerships with our valued customers,” stated Frank Chiu, President of TUC. “With this agreement, TUC will be the first and only licensed laminator based in the Greater China region. The Buried Capacitance materials provide an important addition to our complete and innovative product portfolio.”
The benefits of using Buried Capacitance (BC™) technology can be seen in a variety of areas, particularly in the reduction of high-frequency electromagnetic interference (EMI) and in a quieter power distribution system. Even more, Buried Capacitance potentially reduces many bypass capacitors from the surface of a PCB, which equates to assembly cost reductions and increases the available surface area for increased circuit-routing density. In support of this, the license offers access to a variety of Buried Capacitance materials in the 0- to 4-mil dielectric thickness range.
Sanmina-SCI is known for its leadership in Buried Capacitance technology. Sanmina-SCI holds a worldwide patent portfolio of nine U.S. patents and 22 international patents that constitute proprietary knowledge on superior quality Buried Capacitance products. The patent portfolio includes a wide range of broad claims that cover the structure and use of BC with dielectric thicknesses from 0 mils (0 µm) to 4 mils (101.6 µm) with power/ground pairs, the use of nanopowders to increase the Dielectric Constant (Dk) of dielectrics, the use of prepreg (B-Stage) with power/ground configurations and the surface treatment of foils (Double Treat and RTF) to promote adhesion in Buried Capacitance configurations. A global network of strong licensing partnerships with top-tier PCB manufacturers and laminate material suppliers attests to the value of Sanmina-SCI’s patents.
Sanmina-SCI has developed a dedicated staff to support original equipment manufacturer (OEM) users and the licensee base around the world currently utilizing Buried Capacitance laminate material and manufacturing processes.
About Sanmina-SCI
Sanmina-SCI Corporation is a leading electronics contract manufacturer serving the fastest-growing segments of the global electronics manufacturing services (EMS) market. Recognized as a technology leader, Sanmina-SCI provides end-to-end manufacturing solutions, delivering unsurpassed quality and support to OEMs primarily in the communications, defense and aerospace, industrial and medical instrumentation, computer technology, and multimedia sectors. Sanmina-SCI has facilities strategically located in key regions throughout the world. More information regarding the Company is available at www.sanmina-sci.com.
About TUC
Taiwan Union Technology Corporation, known for its lead-free and RoHS compatible FR-4 base materials and mass lamination service of up to 22 layers, is the second largest FR-4 laminator in Taiwan, and the largest mass lamination service provider in the world. With headquarters in Taiwan and regional offices around the world, TUC has manufacturing plants in Chupei, Taiwan and Changshu, China. More information are available at www.tuc.com.tw.
Sanmina-SCI Safe Harbor Statement
The foregoing, including the discussion regarding the company's future prospects, contains certain forward-looking statements that involve risks and uncertainties, including uncertainties associated with economic conditions in the electronics industry, particularly in the principal industry sectors served by the company, changes in customer requirements and in the volume of sales to principal customers, the ability of Sanmina-SCI to effectively assimilate acquired businesses and achieve the anticipated benefits of its acquisitions, and competition and technological change. The company's actual results of operations may differ significantly from those contemplated by such forward-looking statements as a result of these and other factors, including factors set forth in the company's fiscal year 2004 Annual Report on Form 10-K filed on December 29, 2004 and 10-Q filed on May 12, 2005 with the Securities Exchange Commission.